Products & Services

Semiconductors

:: Direct Materials and Consumables
:: Equipments / Spares
:: Reclaiming Services

Direct Materials and Consumables

http://www.williams-adv.com   PVD Materials - Sputtering Targets - Evaporation Slugs & Pellets - High Purity Metals Packaging Materials - Bonding wires and Ribbon - Lids - Solder Alloy   http://www.ehwadia.com   - Dicing Blades - Back Grinding Wheels - Microblades -CMP Conditioners     • Dicemaster ® • Blademaster™ • Flanges   http://cleanjim.com   • Dicing coolants / surfactant • Silicon Wafer Cleaning Solutions       • Spin-On-Glass - Cospeen 1000 Series • Gap fill & Planarization Application • Thickness of up to 8000 Å with double coat • Excellent planarization; DOP99.2%. • Thermal stability < 3% weight @ 465°C   • Aluminized Wafer • Multilayer Metalized Wafer • Oxide coated wafer • Daisy Chain test chip • Reclaim Wafers Service • Test Wafers • Dummy Wafers • Sizes ranging from 2” – 12”   • Cleanroom/ Laboratory Wipes • Ranging from class 10 to 10k

Equipments / Spares

http://www.jmgpt.com   • Gas Purifiers for H2 and N2 • O2 Remover   http://www.tangosystemsinc.com   • PVD Tool for wafer bumping & metal coating applications

Reclaiming Services

• Whole / Broken Wafers Reclaim Services • Used Sputtering Targets Reclaim