 Products & Services
Printed Circuit Board
Phiron Technology represents leading PCB manufacturers specializing in multilayer printed circuit board and flexible circuit. Our team continuously strives to provide high quality products and exemplary service to meet the customer requirements.
The following technical specifications for the rigid and flexible circuit boards are made to ISO 9002 standards and with U/L approval.
:: PCB Capability
:: Quick-Turn PCB Capabilities
:: FPC Capability
:: Rigid-Flex Capabilities
|
 |
| Line width/Line spacing |
: |
3/3 mils |
| Number of Layers |
: |
up to 18 layers |
| Layer to Layer Registration |
: |
± 4 mils (0.1mm) |
| Min. SMT Pitch |
: |
8 mils (0.2mm) |
| Impedance Control |
: |
± 7% |
| Min. Drill Hole Diameter |
: |
8 mils (0.2mm) |
| Min. Via Size |
: |
6 mils (0.15mm) |
| Hole to Hole Tolerance |
: |
± 2 mils (0.05mm) |
| Hole to Edge Tolerance |
: |
± 4 mils (0.01mm) |
| Micro Via |
: |
4 mils (0.1mm) |
| Hole Aspect Ratio |
: |
1: 8 |
| Solder mask |
: |
Liquid-imageable and conventional UV-curing |
| Soldermask Bridge between Solder Dam |
: |
2.5 mils |
| Soldermask Registration Tolerance |
: |
± 2 mils |
| Surface Finishing |
: |
Hot Air Solder Leveling, OSP, ENIG, Immersion Tin, Electrolytic Gold |
| Inspection |
: |
Automatic Optical Inspection
| |
• Open/short testing |
| |
• Double sided SMD of 0.012” pitch |
|
| 1k/10k clean room |
: |
Artwork plotting, Wet/Dry film, Lamination |
| Artwork generation |
: |
CAM workstation/Laser plotter |
| Data transfer |
: |
Dedicated FTP server |
|
| |
 |
| |
Quick-Turn PCB Capabilities |
|
| Line width/Line spacing |
: |
4/4 mils |
| Maximum Layer Count |
: |
up to 24 layers |
| Board Thickness |
: |
10 mils ~ 125 mils |
| Max Board Size |
: |
24 inches x 21 inches |
| Min Hole Size |
: |
8 mils |
| Blind/Buried Holes |
: |
Sequential Lamination |
| Impedance Tolerance |
: |
± 3 Ohms |
| Difference Impedance |
: |
± 7 Ohms |
| Surface Finishing |
: |
Immersion Gold, Silver, Tin. OSP |
| Production Lead Time |
: |
Up to 3 working days
(Depending on board layer count & processes) |
|
|
 |
| Line Width & Spacing |
: |
2 mils (0.05mm) |
| Copper Thickness |
: |
1/3 oz Min. |
| Layer to Layer Registration |
: |
± 5 mils |
| Min Drill Hole Diameter |
: |
6 mils (0.15mm) |
| Min Via Size |
: |
4 mils (0.1mm) |
| Micro Via |
: |
4 mils (0.1mm) |
| Surface Finish |
: |
Hard Gold, ENIG, Hasl, OSP, Tin Lead Plating, Immersion Tin |
| Cover Layer |
: |
Polyimide/Flexible Soldermask |
| Stiffener Material |
: |
Polyimide/FR4/Metal |
| Shielding Material |
: |
Copper/Silver Ink |
| Tooling Tolerance |
: |
± 1 mils (0.025mm) |
| ZIF Tolerance |
: |
± 2 mils (0.05mm) |
|
| |
|
|
| SRD (Steel Rule Die) division outline, distance of the trace to the outline |
>= 15mils |
| MF (Male Female) punch outline, distance of the trace to the outline |
>= 10mils |
| Laser outline, distance of the trace to the outline |
>= 4mils |
| Distance of the silkscreen to the coverlay |
>= 15mils |
| Distance of the silkscreen to outline as: |
SRD |
|
>= 20mils |
|
>= 15mils |
| Coverlay distance to trace |
>= 6mils |
| |
|
| Coverlay: |
|
| Coverlay registration (mm) |
: 0.15 |
| Soldermask |
: 0.08 |
| Silver film to pad |
: 0.13 |
| Coverlay to trace |
: 0.13 |
| |
|
| Legend: |
|
| Legend high (min) |
: 0.8 |
| Legend width (min) |
: 0.13 |
| Legend space (min) |
: 0.13 |
| Legend registration tolerance |
: 0.2 |
| |
|
| Impedance |
: 10% |
| |
|
| Plated Copper: |
|
| General Thickness |
: 1.0 – 1.4mils |
| Plating Tolerance |
: ± 0.2mils |
|
|
